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Electronics

Precision automation for assembly manufacturing, PCB handling and testing — ESD-capable, repeatable, scalable.

Context

Modular automation for the Electronics industry

Electronics manufacturing is among the most heavily automated industries — SMT lines run 24/7, pick-and-place machines place components at millisecond rates, AOI systems visually inspect every assembly. Still, plenty of work remains that is not suitable for either fast SMT lines or manual assembly: assembly handling between process steps, dispensing tasks, test handling, packaging.

This is exactly where NEXOS plays to its strengths. Compact cells with cobot, precise linear axes and repeatable path guidance — combined with ESD-capable specification — close the automation gap between the SMT line and end-of-line testing.

Automation also becomes economical for smaller batch sizes and product variants: the same cell concept is configured for different assemblies instead of building a custom system each time.

Challenges

What makes this industry challenging to automate

End-to-end ESD safety

Electrostatic discharges of a few volts can destroy modern assemblies. Flooring, tools, handling — everything must be ESD-compliant and regularly verified.

Miniaturization

Components are getting smaller, tolerances tighter. Sub-millimetre precision for handling and dispensing is becoming the standard requirement.

High product variety

A few thousand units per variant, dozens of variants, product cycles under twelve months. Changeover must take minutes — not hours.

Typical applications

What NEXOS automates in the Electronics industry

Relevant products

Components that make these applications possible

Why NEXOS for Electronics

Three reasons for modularity in this industry

Precision and repeat accuracy

NEXOS.Nova achieves repeat accuracy in the sub-millimetre range — sufficient for practically all handling and dispensing tasks in electronics manufacturing.

ESD-capable specification

NEXOS.Cube and NEXOS.Nova are designed for use in ESD-controlled areas — conductive floor connection, dissipative surfaces and documented material selection.

Scalable for small and large batch sizes

A single cell concept that works for 500-unit series as well as for volumes in the millions. Reconfigure instead of rebuild — matches the high-mix reality of electronics manufacturing.

How we work

From inquiry to running system in four steps

1

Analysis

Free initial discussion (30–60 min). We clarify the parts spectrum, cycle times, environmental conditions and integration into your existing IT/OT.

2

Concept

Component selection, layout, schedule, cost framework. On request with virtual commissioning in NEXOS.XR before manufacturing starts.

3

Quotation

Fixed-price or milestone contract, with clearly documented scope of delivery, acceptance criteria and maintenance options.

4

Implementation

Prefabrication in the workshop, on-site assembly, programming, acceptance per documented FAT/SAT. Optional: remote service via NEXOS.DSP.

Standards & Certifications

Relevant standards for the Electronics industry

These regulations are considered in our conception, implementation and documentation. Not every standard applies to every project — the specific selection is clarified in the project kick-off meeting.

IPC-A-610Acceptance criteria for electronic assemblies — Class 1 (consumer), 2 (industrial), 3 (high-reliability, e.g. medical/aerospace).
IPC-J-STD-001Requirements for soldered electrical and electronic assemblies.
ANSI/ESD S20.20 + IEC 61340-5-1Requirements for ESD control programs — flooring, workstations, personnel protection, regular verification.
RoHS 3 (EU 2015/863)Restriction of hazardous substances in electrical/electronic equipment (lead, mercury, cadmium, chromium(VI), PBB, PBDE, DEHP, BBP, DBP, DIBP).
REACHRegistration, evaluation, authorization and restriction of chemical substances — SVHC candidate list to be monitored.
WEEE 2012/19/EUTake-back and disposal obligations for electrical and electronic equipment.
Frequently asked

FAQ on automation in the Electronics industry

Are your cells ANSI ESD S20.20 compliant?
Yes — NEXOS.Cube and NEXOS.Nova are available in an ESD specification: dissipative surfaces, conductive floor connection, documented materials and test records. The cell is integrated as part of your ESD control program; we supply the necessary evidence.
Which component sizes can NEXOS.Nova handle?
NEXOS.Nova achieves repeat accuracy of ±0.05 mm with a suitable end-effector. Components from about 3 mm edge length can be handled with standard grippers; smaller components (e.g. 0201 chip capacitors) require precision grippers and vision support.
How do you integrate cells between the SMT line and AOI?
The cell is positioned as an "island" between the lines — with adapted conveyor height, cycle-time synchronization and standard interfaces to line control (SMEMA, IPC-HERMES-9852). The specific connection is clarified in a layout workshop with your production planning.
How fast is a product changeover (setup time)?
With parameterized recipes: under 15 minutes — a pure software switch plus a gripper change if needed. For structural changes (fixtures, feeders) 1 to 4 hours depending on scope. The goal is always to complete the changeover within a break.

Discuss your application?

Talk to us about your specific automation task in Electronics.

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